JPS5315269Y2 - - Google Patents
Info
- Publication number
- JPS5315269Y2 JPS5315269Y2 JP7538472U JP7538472U JPS5315269Y2 JP S5315269 Y2 JPS5315269 Y2 JP S5315269Y2 JP 7538472 U JP7538472 U JP 7538472U JP 7538472 U JP7538472 U JP 7538472U JP S5315269 Y2 JPS5315269 Y2 JP S5315269Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7538472U JPS5315269Y2 (en]) | 1972-06-26 | 1972-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7538472U JPS5315269Y2 (en]) | 1972-06-26 | 1972-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4933761U JPS4933761U (en]) | 1974-03-25 |
| JPS5315269Y2 true JPS5315269Y2 (en]) | 1978-04-21 |
Family
ID=27977029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7538472U Expired JPS5315269Y2 (en]) | 1972-06-26 | 1972-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5315269Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5638773Y2 (en]) * | 1974-07-02 | 1981-09-10 | ||
| JPH0726853Y2 (ja) * | 1989-06-01 | 1995-06-14 | シャープ株式会社 | Ｌｅｄ表示装置 |
-
1972
- 1972-06-26 JP JP7538472U patent/JPS5315269Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4933761U (en]) | 1974-03-25 |